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商品编号: DVD912575
商品名稱: Cadence IC6.1.7 ISR22 Virtuoso - 電路仿真設計軟件
碟片數量: 1片
銷售價格: 200
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Cadence IC6.1.7 ISR22 Virtuoso - 電路仿真設計軟件
Cadence IC是一款專業好用的電路仿真設計軟件,該軟件主要適用於linux系統平台,我們需要使用相應的命令才能完成各類電路的仿真設計操作,擁有輸入原理,造型(Verilog-AMS),電路仿真,自定義模板等,可以用於標準單元設計,RF,混合和模擬信號,也用於存儲器和FPGA設計等操作.

Cadence Design Systems, Inc. has launched Cadence IC6.1.7 ISR22 Virtuoso, a formal, streamlined and automated co-design and verification flow between the Cadence Virtuoso platform and Allegro and Sigrity technologies. This higher level of integration enables engineers to design concurrently across the chip, package and board.

By automating what has until now been a manual process, the Virtuoso System Design Platform minimizes errors and can reduce layout versus schematic (LVS) time between IC and package from days to minutes.

Until now, advances in silicon technology have been sufficient for continued improvement in microelectronics products. Given the complexity of today’s chips, packages and boards, ICs based on both silicon and non-silicon materials are now required to design optimal high-performance systems. As a result, this trend is driving the need for engineers to integrate multiple heterogeneous technologies in a single product, affecting the performance and functionality of ICs and introducing a new set of challenges for semiconductor companies. To address these challenges, Cadence has developed a novel, cross-platform solution that streamlines and automates the design of a package or module featuring off-chip devices and multiple ICs based on differing process design kits (PDKs).

The Virtuoso System Design Platform allows IC designers to easily include system-level layout parasitics in the IC verification flow, enabling time savings by combining package/board layout connectivity data with the IC layout parasitic electrical model. The resulting automatically generated “system-aware” schematic can then be easily used to create a testbench for final circuit-level simulation. Until now, designers were only able to make changes after time-consuming manual checks involving spreadsheets and other ad hoc/manual methods, which can take days. By automating this entire flow, the Virtuoso System Design Platform eliminates the highly manual and error-prone process of integrating system-level layout parasitic models back into the IC designer’s flow, reducing days of work to mere minutes.

About Cadence Virtuoso System Design Platform. The Cadence Virtuoso System Design Platform links two world-class Cadence technologies—custom IC design and package/PCB design/analysis—creating a holistic methodology that automates and streamlines the design and verification flow for multi-die heterogeneous systems.

Leveraging the Virtuoso Schematic Editor and the Virtuoso Analog Design Environment, it provides a single platform for IC-and package/system-level design capture, analysis, and verification. In addition, the Virtuoso System Design Platform provides an automated bidirectional interface with the Cadence SiP-level implementation environment and Sigrity PowerSI 3DEM Extraction Option.

The Virtuoso System Design Platform allows IC designers to easily include system-level layout parasitics in the IC verification flow, enabling time savings by combining package/board layout connectivity data with the IC layout parasitic electrical model. The automatically generated “system-aware” schematic that results can then be easily used to create a testbench for final circuit-level simulation. The Virtuoso System Design Platform automates this entire flow, eliminating the highly manual and error-prone process of integrating system-level layout parasitic models back into the IC designer’s flow.

Integrated Heterogeneous Devices

Many of today’s analog, RF, and mixed-signal designs require the integration of multiple ICs across varying substrate technologies to achieve required performance goals. The integration of heterogeneous devices allows designers to achieve results that can’t easily be duplicated using a monolithic IC (SoC) design approach. At the same time, heterogeneous integration introduces a whole new set of challenges for today’s designers.

System in a package (SiP) is one of the most common methods of integrating mixed technologies into a single design. This approach requires seamless integration between the IC and package substrate design teams and an integrated tool flow. The Virtuoso System Design Platform addresses these challenges with a novel, cross-platform solution that streamlines and automates the design of a package/module featuring off-chip devices and multiple ICs based on differing process design kits (PDKs).

Standalone Software Shipped with IC6.1.7:

- Virtuoso Power System L (IC6.1.7)
- Voltus-Fi Custom Power Integrity Solution XL IC6.1.7
- Dracula Design Rule Checker (4.9)
- Dracula Layout Vs. Schematic Verifier (4.9)
- Dracula Parasitic Extractor(4.9)
- Dracula Physical Verification Suite(4.9)
- Dracula Physical Verification and Extraction Suite (4.9)
- Virtuoso Chip Assembly Router (11.3)

Cadence Product Releases Compatible with IC6.1.7

Spectre Circuit Simulators…………………………(SPECTRE 17.10.307)
Pegasus/Physical Verification System………………..(PEGASUS 18.20.000)
Assura Physical Verification……………………….(ASSURA 04.15.115)
XCELIUM………………………………………….(XCELIUMMAIN 18.03.008)
Conformal………………………………………..(CONFRML 18.10.100)
Innovus………………………………………….(INNOVUS 18.10.000)
Manufacturability and Variability Sign-off ………….(MVS 17.23.000)
Extraction Tools (QRC/Quantus QRC)………………….(EXT 18.11.000)
Allegro Sigrity…………………………………..(SIG 17.00.010)
Silicon-Package-Board Co-Design…………………….(SPB 17.20.043)

Watch an RF demo showing the extraction of an inductor from layout and the impact on circuit simulation of a VCO. The Cadence Virtuoso RF Solution improves design cycle productivity, reducing errors in manufacturing and accounting for the electrical and physical effects within a single environment across IC, package, and board design. Its bidirectional interface integrates with the Cadence SiP-level implementation environment, Sigrity PowerSI 3DEM Extraction Option finite element engine, and NI AWR Design Environment platform’s AXIEM 3D planar EM software to automate hours of manual work in RFIC and RF Module designs.

About Cadence. Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.

Product: Cadence Virtuoso System Design Platform
Version: IC6.1.7 ISR22*
Supported Architectures: x86
Website Home Page : http://www.cadence.com
Language: english
System Requirements: Linux
Supported Operating Systems: RHEL 5, RHEL 6, SLES 11.0

* The IC6.1.7 ISR stream is a cumulative stream of all hotfixes that are submitted after the base release.
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